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激光切割是利用高功率密度激光束照射被切割材料，使材料很快被加熱至汽化溫度，蒸發(fā)形成孔洞，隨著光束對(duì)材料的移動(dòng)，孔洞連續(xù)形成寬度很窄的（如0．1mm左右）切縫，完成對(duì)材料的切割。

激光切割可分為以下四類

1.激光汽化切割

2.激光熔化切割

3.激光氧氣切割

4.激光劃片控制斷裂

Laser cutting uses high-power density laser beams to irradiate the cut material, so that the material is quickly heated to vaporization temperature and evaporates to form holes. As the beam moves toward the material, the holes continuously form a narrow width(eg, about 0.1 mm).) Cutting seams, Complete the cutting of the material.
Laser cutting can be divided into the following four categories
1. Laser vaporization cutting
2. Laser melting and cutting
3. Laser oxygen cutting
4. Laser splicing control fracture